Learn about the origin of the SMT production mode

SMT
Surface mount technology, is an electronic load the technology that originated in the 1980s, originating in the United States military technology, development, maturity in Japan in the 1990s Taiwan e-Generation factory development. The electronic components, such as a resistor, capacitor, transistor, ICS, and so on installed on the printed circuit board and the solder formed by 釬 electrical connected. And the plug-in package is different maximum surface mount technology components are not required to set aside the pins corresponding through hole and surface mount technology component size than plug-in package.

Cog is the LCD glass with the use of the wireless link and adhesive paste, direct connect bare chip are now joining technology is the COG long have gold and block driver IC Bare Chip, the ACF directly with the LCD panel to the connection. Electronic Manufacturing information industry is the most important industry of electronics assembly manufacturing, assembly) is pcba(printed circuit board of the most basic and important part of the General SMT( surface will be part adhesive) and DIP( traditional part plug-in). In the electronics manufacturing process, a dream goal is to raise function density and toward the thin short of even more functionality in the same circuit board area or to maintain the same features as the , but the area to zoom out, the only way only the electronic parts, then replace the traditional narrow parts developed surface mount technology (SMT: surface mount technology). Surface mount technology is produced in the traditional electronics chip electronic parts and to the disc packaging and PCB board hole plug-in from the traditional approach to fast adhesive surface on the PCB and PCB is also reduced space development from single-layer board for multi-layer board. The current electronic assembly industry in one of the most popular technologies and processes.