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NOTE:
1.MATERIAL SPECIFICATION:
1-1.HOUSING:LCP,UL94V-0.
1-2.CONTACTS:COPPER ALLOY(C1814)
1-3.MID PLATE:STAINLESS STEEL(SUS301)
1-4.FRONT SHELL:STAINLESS STEEL(SUS304)
1-5.EMI PLATE:STAINLESS STEEL(SUS304)
2.PLATING SPECIFICATION:
2-1.CONTACTS:Ni 50u" MIN. UNDER PLATED OVER ALL.
Au PLATED ON THE FUNCTIONAL AREA OF CONTACT.(GOLD PLATING THICKNESS FOLLOW THE P/N)
PLATING SPECIFICATIONS OF THE SOLDER AREA FOLLOW THE P/N
2-2.FRONT SHELL:Ni 30u" MIN. UNDER PLATED OVER ALL.
2-3.MID PLATE & EMI PLATE:CLEAR ONLY
3.MECHANICAL PERFORMANCE:
3-1.INSERTION FORCE:0.5~2.0kgf.
3-2.REMOVAL FORCE:0.8kgf~2.0kgf.
3-3.DURABILITY:10000 CYCLES.
4.ELECTRICAL PERFORMANCE:
4-1.CURRENT RATING:5.0A
VOLTAGE RATING:5.0V
4-2.LLCR:VBUS & GND PINS AND OTHER PINS:40mΩ/PIN MAX.
SHIELD:50mΩ/MAX.
LLCR MAX. CHANGE OF ALL PINS:10mΩ.
4-3.INSULATION RESISTANCE:100MΩ MIN
4-4.DIELECTRIC WITHSTAND VOLTAGE, AC 100V FOR 1 MINUTE.
5.ENVIRONMENTAL PERFORMANCE:OPERATING TEMPERATURE:-25°C ~ +85°C.
6.IR REFLOW:THE PEAK TEMPERATURE ON THE BOARD SHALL BE MAINTAINED FOR 10 SECONDS AT 260°C.